Foxconn Picks 28 Contractors For $100 Million In Work

RACINE COUNTY, WI — A group of 28 Wisconsin and Illinois subcontractors have been picked by Foxconn and its general contractor, Gilbane, to conduct an estimated $100 million in site development work in preparation for a $10 billion electronics plant and campus in Racine County.

All but one of the companies named are based in Wisconsin, the other is an Illinois-based company. The contracts awarded have a total value of $100 million. The site development work includes erosion control, mass excavation, stormwater management and testing work. This phase of the construction project will require 500,000 hours of work on site and create 800 direct and indirect jobs.

“As we actively move forward with construction of this project, we look forward to partnering with additional Wisconsin companies as we begin to create 13,000 jobs and build the foundation for the robust AI 8K+5G ecosystem that Foxconn is building in Wisconsin to eventually reach all parts of the United States,” said Louis Woo, special assistant to Foxconn Founder and CEO Terry Gou in a prepared statement Monday morning.

Below is the list of area companies slated to do the work:

The size and scope of the proposed project is staggering: The roughly 20-million-square-foot plant will be located just north of County Line Road and just east of I-94 in Mount Pleasant in southern Racine County, according to local officials. That expanse is bordered by Braun Road to the north and Highway H to the east.

"This will be one of the largest manufacturing campuses in the world," Racine County Executive Jonathan Delagrave said during Foxconn's public unveiling in late 2017. "This represents the return of electronics manufacturing to the U.S. from Asia and it establishes Wisconsin, and Racine County in particular as the electronics manufacturing capitol of North America."

According to company officials, the new campus will consist of a multi-billion thin-film transistor (TFT) liquid crystal display (LCD) plant, a facility to back-end package liquid crystal display modules, a skill-intensive facility focused on molding and tool-and-die processes and an end-set assembly operation to produce end-device units.

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